Work-Study & Scholarships

TEXAS COLLEGE WORK-STUDY (TCWS) Available

TCWS program funds are available to eligible students attending public and private/independent institutions of higher education, as defined in TEC Section 61.003(8). This program is authorized by TEC, Chapter 56, Subchapter E, Section 56.073. Rules establishing procedures to administer the subchapter can be found in Title 19 of the TAC, Chapter 22, Subchapter G.

 

WORK-STUDY STUDENT MENTORSHIP PROGRAM (WSMP)

The Work-Study Student Mentorship Program (WSMP) is authorized by Chapter 56, Section 56.079 in Subchapter E of the Texas Education Code. Rules establishing procedures to administer the subchapter can be found in Title 19 of the TAC, Chapter 22, Subchapter G.

The purpose of the mentorship program is to provide employment to eligible students to mentor, tutor, or advise students at participating institutions of higher education or high school students within local school districts and nonprofit organizations. The primary goal of the program is to improve student access, success, and completion of higher education. These student mentorship positions are funded by a combination of state appropriations provided by the Texas College Work-Study (TCWS) Program and matching funds from participating institutions.

 

BILINGUAL EDUCATION PROGRAM

Program funds are available to students attending the following institutions: University of North Texas, University of North Texas at Dallas, Texas Woman’s University, The University of Texas at Dallas, The University of Texas at Arlington, Texas A&M Commerce, DFW Tech Teach, in consultation with Texas Tech University.

 

TEXAS ARMED SERVICES SCHOLARSHIP PROGRAM (TASSP)

TASSP program funds are available to students attending public and private or independent institutions of higher education, as defined in TEC, Section 61.003. This program is authorized by TEC, Chapter 61, Subchapter A, Section 61.9771. Rules establishing procedures to administer the subchapter can be found in Title 19 of the TAC, Chapter 22, Subchapter I.