Restricted Research - Award List, Note/Discussion Page

Fiscal Year: 2021

219  University of North Texas  (84515)

Principal Investigator: Chyan,Oliver M R

Total Amount of Contract, Award, or Gift (Annual before 2011): $ 116,000

Exceeds $250,000 (Is it flagged?): No

Start and End Dates: - 6/30/21

Restricted Research: YES

Academic Discipline: Chemistry

Department, Center, School, or Institute: College of Science

Title of Contract, Award, or Gift: Optimization of Corrosion Prevention Treatments for Cu Wire Bonded Devices to Achieve High Bonding Reliability

Name of Granting or Contracting Agency/Entity: NXP Semiconductors


Program Title: N/A


This research project aims to develop manufacture-compatible corrosion prevention treatments to maximize the reliability of Cu wire bonded device assembly in harsh operation environments. With NXP gift grant support, we will systematically develop chemical vapor deposition (CVD) process to selectively deposit inhibitors on Cu wire bonded devices provided by NXP. In situ corrosion screening on un-molded devices and subsequent characterization by SEM and XPS will provide important correlation of inhibitor coating conditions to the effectiveness of preventing corrosion related defects. Failure analyses based on electrical test on inhibitor pretreated devices, after stringent humidity and thermal stress treatments, will be carried out in NXP’s manufacture-compatible wire bonding and molding facilities. The overall objective is to establish a corrosion prevention treatment that is highly effective, low cost, compatible to current packaging operation and stable under 260 °C re-flow treatment.

Discussion: No discussion notes


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